Solid phase bonding SSP (intermittent)

The solid-phase bonding device is mainly the granular material of the melt polymerization device, which achieves the purpose of increasing the characteristic viscosity value by controlling the grain temperature and residence time, and generally has the steps of crystallization, preheating, reaction and cooling.

Device Introduction

Continuous solid-phase viscosity-increasing device: Suitable for mass production, product stability, easy to operate, energy-saving and environmental protection;

Intermittent Solid-Phase bonding device: Suitable for small-scale production, product easy to adjust, energy-saving economy.